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High temperature suppression
The MDT series adopts the classic Wheatstone bridge principle, but innovatively adopts double Wheatstone bridges in the bridge design to realize "double beams" on the bridge. The temperature characteristics of the bridge resistance of the double-girder bridge are complementary. When the self-heating change or noise interference occurs in the bridge, the double-girder bridge realizes self-compensation, which greatly improves the anti-interference ability and long-term stability of the chip. MEMS silicon sensor chips all require a metallization process to lead out the internal leads of the bridge resistance and form a certain area of metal binding area. This metal wire and metal binding area will also have a stress impact on the silicon sensing film surface. MDT adopts a fully symmetrical "plum mirror" metallization layout, and lays out the metallized part on the edge of the chip. When the temperature and pressure change, the metallized part changes evenly and symmetrically. The bridge resistor with a resistance value of 10kΩ can effectively control the influence of temperature and ensure a high signal-to-noise ratio of the output signal.。
High stability